05 · Intermediate

Gain, loading & output swing

Close the single-stage design loop by combining source attenuation, transistor-stage gain, output loading and large-signal headroom in one workflow. Start from a complete source–amplifier–load circuit, derive the source-to-load gain rather than an isolated intrinsic gain, locate the valid output window from device-region inequalities, translate that window back to an allowable input amplitude, and show how bias current, gm, output resistance and loading trade against one another.

210–270 minIntermediate
In this lesson
  • Distinguish intrinsic transistor-stage gain from end-to-end source-to-load voltage gain.
  • Derive input attenuation through source resistance and finite amplifier input resistance before multiplying by the intrinsic stage gain.
  • Include external load resistance in the output-node resistance rather than applying an unrelated gain correction afterward.
  • Write end-to-end gain as the product of input transfer and loaded stage gain under clearly stated small-signal assumptions.
  • Determine Vout,min and Vout,max from transistor operating-region/compliance conditions, not merely from the supply rails.
  • Compute the maximum symmetric output excursion around a chosen Q-point as the distance to the nearest valid-region boundary.
  • Translate output-swing allowance into an approximate maximum input amplitude using the local loaded gain, while stating the limits of that approximation.
  • Explain why moving Q can trade positive and negative swing margin without changing the local gain formula itself.
  • Compare resistor-loaded and active-loaded stages in terms of gain, current, headroom and sensitivity to external loading.
  • Apply a repeatable design workflow: choose Q/current → verify regions → linearize → include source/load networks → compute gain → check swing → iterate.
Starting question

An amplifier is not only a transistor gain formula. The source must drive the input network, the transistor stage must remain linear around a valid Q-point, the external load changes the output resistance, and the output must stay inside the large-signal operating window. This chapter combines all four constraints.

05.1Three different gains must not be confused

Figure 5.1 — The real problem: source, input, active stage and load

The one question is: what fraction of the source signal actually reaches the load before headroom is exceeded?

Q2Q1VDDVBPvoutRLRsvsRinvi

Rs and Rin set input attenuation. Q1 and Q2 set local gain and headroom. RL directly loads the output node. These effects belong in one circuit model rather than in disconnected formulas.

Define vs at the source, vi at the amplifier input, and vo at the load. Then separate input transfer from stage gain:

αin = vi/vs
Astage = vo/vi
ASL = vo/vs = αinAstage

Quoting Astage while the source sees severe input attenuation overstates the usable source-to-load gain.

05.2Input loading comes first

If the source has resistance Rs and the amplifier presents small-signal input resistance Rin, the simplest divider gives

αin = Rin/(Rs+Rin)

For a MOS stage Rin is usually set by the gate-bias network at low frequency, not by DC gate conduction. For a BJT stage it also includes rπ and any bias network. Coupling capacitors add frequency dependence outside the assumed midband range.

05.3External loading belongs inside the output-node equation

For the actively loaded MOS stage of chapter 04, the unloaded incremental resistance is approximately ro,n∥ro,p. Connecting RL changes the same node:

Rout,L = ro,n ∥ ro,p ∥ RL
Astage ≈ −gm,nRout,L
ASL ≈ −[Rin/(Rs+Rin)]gm,nRout,L

The same structure applies to a CE stage after replacing its input and output model elements by the corresponding BJT quantities.

05.4Output swing starts from device-region boundaries

Let the valid output interval be Vmin≤vout≤Vmax. For the complementary MOS active-load stage, the first long-channel saturation estimate is

Vmin ≈ VOV,n
Vmax ≈ VDD−|VOV,p|

For resistor-loaded stages the upper and lower boundaries follow from the load line and the transistor region limits. For BJTs they follow from cutoff/saturation or, more rigorously, the junction-bias conditions.

05.5Symmetric swing depends on where Q is placed

If VOQ is the quiescent output voltage, the largest region-limited symmetric peak excursion is

Vo,pk,max = min(VOQ−Vmin, Vmax−VOQ)

If the only goal were symmetric voltage swing, the geometric midpoint would be

VOQ,opt ≈ (Vmin+Vmax)/2

Real bias networks, required current, distortion and common-mode constraints can prevent choosing that point freely. Mid-supply is not a universal optimum when headroom is asymmetric.

05.6Translate output headroom back to the input

Using the local loaded gain only as a first estimate,

|vi,pk| ≲ Vo,pk,max/|Astage|
|vs,pk| ≲ Vo,pk,max/|ASL|

This does not prove low distortion at that amplitude. Transistor transfer laws are nonlinear, so a conservative linear signal is usually smaller. The formula is a consistency bound linking a local derivative to a large-signal region limit.

05.7Worked end-to-end example

Take VDD=5 V, VOV,n=0.25 V, |VOV,p|=0.30 V, gm=5 mS, ro,n=100 kΩ, ro,p=120 kΩ, RL=50 kΩ, Rin=200 kΩ and Rs=20 kΩ.

Rout,L = 100 kΩ ∥ 120 kΩ ∥ 50 kΩ ≈ 26.09 kΩ
Astage ≈ −0.005×26.09 kΩ ≈ −130.4
αin = 200/(200+20) ≈ 0.909
ASL ≈ −118.6

The region window is approximately 0.25 V to 4.70 V. Its midpoint is 2.475 V and the symmetric region-limited output amplitude there is 2.225 V peak. The corresponding first estimates are about 17.1 mV peak at the amplifier input and 18.8 mV peak at the source. A practical low-distortion limit would be chosen smaller and checked with the nonlinear model or simulation.

05.8What clipping tells you

Lower-side clipping can indicate the amplifying device is losing saturation/forward-active headroom; upper-side clipping can indicate the load device is leaving its current-source-like region. Asymmetric clipping therefore carries information about Q placement and the two different compliance margins.

If the measured small-signal gain is lower than predicted before clipping, first check source attenuation, external loading, finite ro and degeneration before blaming transistor gm.

05.9A repeatable design loop

  1. Choose supply, topology and target bias current.
  2. Solve DC bias and verify every transistor region.
  3. Compute the large-signal output window.
  4. Linearize at the actual Q-point and obtain gm, rπ where relevant, and ro.
  5. Include source resistance, bias-network input resistance and external load.
  6. Derive source-to-load gain from the complete small-signal circuit.
  7. Translate output headroom back to allowable input amplitude.
  8. Check distortion, power and parameter sensitivity; then iterate Q/current/component values.

05.10Mastery exercises

  1. Rs=10 kΩ and Rin=40 kΩ. Find αin.
  2. ro,n=60 kΩ, ro,p=90 kΩ and RL=30 kΩ. Find Rout,L.
  3. If gm=3 mS for problem 2, find Astage and then ASL using problem 1.
  4. Vmin=0.30 V, Vmax=4.40 V and VOQ=2.0 V. Find maximum symmetric region-limited output peak.
  5. Where should VOQ be placed for symmetric region margins in problem 4?
  6. If |ASL|=40 and available output peak is 1.2 V, estimate the source peak limit.
Solutions

1. 40/(10+40)=0.80.

2. 60 kΩ∥90 kΩ=36 kΩ; 36 kΩ∥30 kΩ≈16.36 kΩ.

3. Astage≈−49.1; ASL≈−39.3.

4. min(2.0−0.30,4.40−2.0)=1.70 V peak.

5. (0.30+4.40)/2=2.35 V.

6. About 30 mV peak, before adding a distortion margin.

AE-02 is now conceptually closed: device models became biased stages, buffers, mirrors, active loads and finally an end-to-end gain/headroom design workflow.